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A New Dimension of Wire Bonding

2021-03-24 11:14:11
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A New Dimension of Wire Bonding
Content:

AEROCAM Series A New Dimension of Wire Bonding


Feature


●30% UPH improvement


●Based on typical copper wire applications


●22μm wire bond ball


●Expert-level skills, in the case of 0.5mil wire, the wire bond ball can be as small as 22μm


●High-end applications of ultra-fine 30μm solder joints


Other configurations adapted to the market


●AEROCAM-G


●AEROCAM-I



Size


Width, depth and height


1284 x 1550 x 1760 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2302, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen