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Automatic Laser Scribing System

2021-03-24 11:40:06
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Automatic Laser Scribing System
Content:

LS100-2 Automatic Laser Scribing System


Feature


●Specially cut sapphire substrate or metal substrate


●Dual worktable design to improve the utilization rate of laser head


●Fully automatic wafer processing system


●Can process up to 50 wafers


●Maximum 4" wafer processing capacity


●Advanced image recognition capabilities


●Edge detection


●Cut width inspection


●Multi-point height measurement (patent pending)


●Processing of non-complete wafers



Size


Width, depth and height


2,080 x 1,270 x 2,080 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2302, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen