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ASM Encapsulation Solution for Large Format Packaging

2021-03-24 11:35:28
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ASM Encapsulation Solution for Large Format Packaging
Content:

ORCAS Series ASM Encapsulation Solution for Large Format Packaging


Feature


●Independent packaging equipment, also suitable for die up and die down wafer level and substrate packaging


●Suitable for KOZ and overmold products


●Powder and liquid encapsulation resin can be used. Automatic control of dispensing and powder coating method, speed and shape, the accuracy can reach ±1%


●Use non-polluting separation film in the packaging to ensure that the mold is clean throughout the process


●Innovative technology is applied to the production line, fully automatic processing of 12-inch (without wafer ring) or 8-inch (with wafer ring) wafer products



Size


Width, depth and height


2470 x 4020 x 2230 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2302, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen