AD50iPro ASMPT Automatic Die Bonding System

Feature

●High-speed die bonding: 50 ms die bonding cycle*

●Excellent bonding performance

●XY position accuracy: ± 25 µm @ 3σ

●Chip angle accuracy: ± 3° *

●Small chip processing capacity-as small as 3 mil

●Large substrate processing capacity-up to 270 x 100mm

●Comprehensive quality inspection-post-weld inspection

●Real-time die bonding performance detection

●Automatically collect solid crystal data

●Convenient production management and quality control

●Save production cost

●Using linear motors, greatly saving maintenance costs

●Power saving, low energy consumption

●High production area ratio, more effective use of plant space

Size

Width, depth and height

1570 x 1160 x 2057 mm³