Best Soon Electronic Technology Co., Ltd. is located in the forefront of China's science and technology city-Shenzhen, specializing in semiconductor packaging equipment, materials and related technology services. The company mainly provides ASMPT LTD welding and packaging equipment, ASMPT equipment and technology are in a priority position in the world. The company is equipped with a professional senior engineer and after-sales service team, with strong strength and excellent management service experience, to design advanced and reasonable humanized process for customers to help customers improve their process and product quality. The Customer Service Department has a complete service system, providing customers with fast, transparent and high-quality services from installation and commissioning to after-sales service. The company strives for survival by quality service, develops by technological progress, and dedicates excellent service quality to customers. The company adheres to the business philosophy of "customer first, integrity-based, continuous innovation", and is committed to the policy of customer first and quality first. The company continues to improve, with the enterprise spirit of "timely, accurate, innovative and enterprising", and establishes long-term and loyal partnerships with customers. We sincerely welcome friends from all walks of life at home and abroad to negotiate and develop together.

ASMPT company profile

Established in Hong Kong in 1975, the group is the world's first equipment manufacturer to provide technology and solutions for all process steps of semiconductor packaging and electronic product production, including semiconductor packaging materials and back-end (chip integration, soldering, packaging) to SMT process. No other equipment supplier in the world has a similar comprehensive product portfolio and extensive knowledge and experience of assembly and SMT procedures.

The back-end equipment business produces and provides semiconductor assembly and packaging equipment for microelectronics, semiconductor, optoelectronics, and optoelectronics markets. It provides diversified products: ASMPT IC packaging equipment, ASMPT die bonder, ASMPT wire bonder die bonder system, wire bonder system, glue dispensing system, rib cutting and forming system, all-round production line equipment. The material business produces and provides semiconductor packaging materials, consisting of a lead frame part and a molded interconnect substrate part. The SMT solution business is responsible for the development of SMT, semiconductor, solar energy markets and DEK printers, as well as excellent SIPLACE SMT placement solutions. ASMPT is headquartered in Singapore and has been listed on the Hong Kong Stock Exchange since 1989.